ADR291GRU ,Precision, Micropower 2.5 V XFET™ ReferenceGENERAL DESCRIPTION 12 µA, making these devices ideal for battery-powered instrumen-The ADR291 and ..
ADR291GRU ,Precision, Micropower 2.5 V XFET™ ReferenceSPECIFICATIONS (V = 5 V to 15 V, T = 25C, unless otherwise noted.)S AParameter Symbol Conditions M ..
ADR291GRU-REEL7 ,Low Noise Micropower Precision Voltage ReferencesSpecificationsS A AParameter Symbol Conditions Min Typ Max UnitsTEMPERATURE COEFFICIENT/
ADR291GRU-ADR291GRUZ-ADR291GRZ-ADR292GRU-ADR292GRUZ-REEL7
Precision, Micropower 2.5 V XFET™ Reference
REV.C
Low Noise Micropower
2.5 V and 4.096 V
Precision Voltage References
FEATURES
Supply Range
2.8 V to 15 V, ADR291
4.4 V to 15 V, ADR292
Supply Current 12 �A Max
Low-Noise 8 �V and 12 �V p-p (0.1 Hz to 10 Hz)
High Output Current 5 mA
Temperature Range �40�C to �125�C
Pin Compatible with REF02/REF19x
APPLICATIONS
Portable Instrumentation
Precision Reference for 3 V and 5 V Systems
A/D and D/A Converter Reference
Solar-Powered Applications
Loop-Current-Powered Instruments
PIN CONFIGURATIONS
8-Lead SOIC (R-8)
8-Lead TSSOP (RU-8)
ADR29x Product
GENERAL DESCRIPTIONThe ADR291 and ADR292 are low noise, micro-power precision
voltage references that use an XFET® reference circuit. The new
XFET architecture offers significant performance improvements
over traditional band gap and buried Zener based references.
Improvements include one quarter the voltage noise output of
band gap references operating at the same current, very low and
ultralinear temperature drift, low thermal hysteresis, and excellent
long-term stability.
The ADR29x family are series voltage references providing stable
and accurate output voltages from supplies as low as 2.8 V for the
ADR291. Output voltage options are 2.5 V and 4.096 V for the
ADR291 and ADR292, respectively. Quiescent current is only
12 µA, making these devices ideal for battery-powered instrumen-
tation. Three electrical grades are available offering initial
output accuracies of ±2 mV, ±3 mV, and ±6 mV max for the
ADR291, and ±3 mV, ±4 mV, and ±6 mV max for the ADR292.
Temperature coefficients for the three grades are 8 ppm/°C,
15 ppm/°C, and 25 ppm/°C max, respectively. Line regulation and
load regulation are typically 30 ppm/V and 30 ppm/mA, main-
taining the reference’s overall high performance. For a device
with 5.0 V output, refer to the ADR293 data sheet.
The ADR291 and ADR292 references are specified over the ex-
tended industrial temperature range of –40°C to +125°C. Devices
are available in the 8-lead SOIC and 8-lead TSSOP packages.
ADR291/ADR292
ADR291–SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
(VS = 3.0 V to 15 V, TA = –40�C ≤ TA ≤ +125�C, unless otherwise noted.)
(VS = 3.0 V to 15 V, TA = –25�C ≤ TA ≤ +85�C, unless otherwise noted.)
(VS = 3.0 V to 15 V, TA = 25�C, unless otherwise noted.)
ADR291/ADR292
ADR292–SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
ELECTRICAL SPECIFICATIONSLINE REGULATION
ELECTRICAL SPECIFICATIONSLINE REGULATION
(VS = 5 V to 15 V, TA = 25�C, unless otherwise noted.)
(VS = 5 V to 15 V, TA = –40�C ≤ TA ≤ +125�C, unless otherwise noted.)
(VS = 5 V to 15 V, TA = –25�C ≤ TA ≤ +85�C, unless otherwise noted.)
ADR291/ADR292
ABSOLUTE MAXIMUM RATINGSSupply Voltage..................................................................18 V
Output Short-Circuit Duration to GND....................Indefinite
Storage Temperature Range
SO, RU Package......................................�65°C to �150°C
Operating Temperature Range
ADR291/ADR292...................................�40°C to �125°C
Junction Temperature Range
R, RU Package........................................�65°C to �125°C
Lead Temperature (Soldering, 60 sec)............................300°C
NOTESStresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating only; functional
operation at or above this specification is not implied. Exposure to the
above maximum rating conditions for extended periods may affect device
reliability.
2. Remove power before inserting or removing units from their sockets.
*θJA is specified for worst-case conditions, i.e., θJA is specified for device in socket
testing. In practice, θJA is specified for a device soldered in the circuit board.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
ORDERING GUIDESee ADR293 data sheet for ordering guide.
OTHER XFET PRODUCTS
PARAMETER DEFINITIONS
Line RegulationThe change in output voltage due to a specified change in input
voltage. It includes the effects of self-heating. Line regulation is
expressed in either percent-per-volt, parts-per-million-per-volt,
or microvolts-per-volt change in input voltage.
Load RegulationThe change in output voltage is due to a specified change in
load current. It includes the effects of self-heating. Load
regulation is expressed in either microvolts-per-milliampere,
parts-per-million-per-milliampere, or ohms of dc output resistance.
Long-Term StabilityTypical shift of output voltage at 25°C on a sample of parts
subjected to a test of 1000 hours at 125°C.
where:
VO (t0) = VO at 25°C at time 0
VO (t1) = VO at 25°C after 1000 hours operation at 125°C
Temperature CoefficientThe change of output voltage over the operating temperature
change and normalized by the output voltage at 25°C, ex-
pressed in ppm/°C. The equation follows:
where:
VO (25°C) = VO at 25°C
VO(T1) = VO at Temperature 1
VO(T2) = VO at Temperature 2
NC = No Connect.
There are in fact internal connections at NC pins that are re-
served for manufacturing purposes. Users should not connect
anything at NC pins.
Thermal HysteresisThermal hysteresis is defined as the change of output voltage
after the device is cycled through temperature from +25°C to
–40°C to +85°C and back to +25°C. This is a typical value from
a sample of parts put through such a cycle.
where:
VO (25°C) = VO at 25°C
VO–TC = VO at 25°C after temperature cycle at +25°C to
–40°C to +85°C and back to +25°C
ADR291/ADR292–Typical Performance CharacteristicsTPC 1.ADR291 VOUT vs. Temperature
TPC 2.ADR292 VOUT vs. Temperature
TPC 3.ADR291 Quiescent Current vs. Input Voltage
TPC 4.ADR292 Quiescent Current vs. Input Voltage
TPC 5.ADR291/ADR292 Supply Current vs. Temperature
TPC 6.ADR291/ADR292 Line Regulation vs. Temperature
TPC 7.ADR291/ADR292 Line Regulation vs. Temperature
TPC 8.ADR291 Minimum Input-Output Voltage
Differential vs. Load Current
TPC 9.ADR292 Minimum Input-Output Voltage
Differential vs. Load Current
TPC 10.ADR291 Load Regulation vs. Temperature
TPC 11.ADR292 Load Regulation vs. Temperature
TPC 12.ADR291 ∆VOUT from Nominal vs. Load Current
ADR291/ADR292
SOURCING LOAD CURRENT – mA
–40000.1101
OUT
FROM NOMINAL –
–1500TPC 13.ADR292 ∆VOUT from Nominal vs. Load Current
TPC 14.Voltage Noise Density vs. Frequency
TPC 15.ADR291/ADR292 Ripple Rejection vs. Frequency
TPC 16.ADR291 0.1 Hz to 10 Hz Noise
TPC 17.ADR291 Output Impedance vs. Frequency
TPC 18.ADR292 Output Impedance vs. Frequency
