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AD845AQADN/a1avaiPrecision, 16 MHz CBFET Op Amp
AD845BQADN/a105avaiPrecision, 16 MHz CBFET Op Amp
AD845JNADN/a100avaiPrecision, 16 MHz CBFET Op Amp
AD845KNN/a6avaiPrecision, 16 MHz CBFET Op Amp


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AD845AQ-AD845BQ-AD845JN-AD845KN
Precision, 16 MHz CBFET Op Amp
REV. DPrecision, 16 MHz
CBFET Op Amp
CONNECTION DIAGRAMSFEATURES
Replaces Hybrid Amplifiers in Many Applications
AC PERFORMANCE:
Settles to 0.01% in 350 ns
100 V/ms Slew Rate
12.8 MHz min Unity-Gain Bandwidth
1.75 MHz Full-Power Bandwidth at 20 V p-p
DC PERFORMANCE:
0.25 mV max Input Offset Voltage
5 mV/8C max Offset Voltage Drift
0.5 nA Input Bias Current
250 V/mV min Open-Loop Gain
4 mV p-p max Voltage Noise, 0.1 Hz to 10 Hz
94 dB min CMRR
Available in Plastic Mini-DIP, Hermetic Cerdip and
SOIC Packages. Also Available in Tape and Reel in
Accordance with EIA-481A Standard
PRODUCT DESCRIPTION

The AD845 is a fast, precise, N channel JFET input, monolithic
operational amplifier. It is fabricated using Analog Devices’
complementary bipolar (CB) process. Advanced laser-wafer
trimming technology enables the very low input offset voltage
and offset voltage drift performance to be realized. This preci-
sion, when coupled with a slew rate of 100 V/μs, a stable
unity-gain bandwidth of 16 MHz, and a settling time of 350 ns
0.01%—while driving a parallel load of 100 pF and 500 Ω—
represents a combination of features unmatched by any FET
input IC amplifier. The AD845 can easily be used to upgrade
many existing designs which use BiFET or FET input hybrid
amplifiers and, in some cases, those which use bipolar input op
amps.
The AD845 is ideal for use in applications such as active filters,
high speed integrators, photo diode preamps, sample-and-hold
amplifiers, log amplifiers, and in buffering A/D and D/A con-
verters. The 250 μV max input offset voltage makes offset null-
ing unnecessary in many applications. The common-mode
rejection ratio of 110 dB over a ±10 V input voltage range
represents exceptional performance for a JFET input high
speed op amp. This, together with a minimum open-loop
gain of 250 V/mV ensures that 12-bit performance is achieved,
even in unity-gain buffer circuits.
The AD845 conforms to the standard op amp pinout except
that offset nulling is to V+. The AD845J and AD845K grade
devices are available specified to operate over the commercial
0°C to +70°C temperature range. AD845A and AD845B
devices are specified for operation over the –40°C to +85°C
industrial temperature range. The AD845S is specified to oper-
ate over the full military temperature range of –55°C to
+125°C. Both the industrial and military versions are available
in 8-pin cerdip packages. The commercial version is available in
an 8-pin plastic mini-DIP and 16-pin SOIC; “J” and “S” grade
chips are also available.
PRODUCT HIGHLIGHTS
The high slew rate, fast settling time, and dc precision of the
AD845 make it ideal for high speed applications requiring
12-bit accuracy.The performance of circuits using the LF400, HA2520/2/5,
HA2620/2/5, 3550, OPA605, and LH0062 can be upgraded
in most cases.The AD845 is unity-gain stable and internally compensated.The AD845 is specified while driving 100 pF/500 Ω loads.
Plastic Mini-DIP (N) Package
and Cerdip (Q) Package
16-Pin SOIC
(R-16) Package
AD845–SPECIFICATIONS
(@ +258C and 615 V dc, unless otherwise noted)

NOTESInput offset voltage specifications are guaranteed after 5 minutes of operation at TA = +25°C.Bias current specifications are guaranteed maximum at either input after 5 minutes of operation at TA = +25°C.FPBW = slew rate/2 π V peak.“S” grade TMIN–TMAX are tested with automatic test equipment at TA = –55°C and TA = +125°C.
All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units at final electrical test. Results from these tests are
ORDERING GUIDE
ABSOLUTE MAXIMUM RATINGS1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Internal Power Dissipation2
Plastic Mini-DIP . . . . . . . . . . . . . . . . . . . . . . . . . .1.6 Watts
Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4 Watts
16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5 Watts
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+ VS
Output Short-Circuit Duration . . . . . . . . . . . . . . . .Indefinite
Differential Input Voltage . . . . . . . . . . . . . . . . . .+VS and –VS
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +150°C
N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +125°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . .+300°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability .
2Mini-DIP package: θJA = 100°C/watt; cerdip package: θJA = 110°C/watt. SOIC
package: θJA = 100°C/W.
METALIZATION PHOTOGRAPH

Dimensions shown in inches and (mm).
Contact factory for latest dimensions.
SUBSTRATE CONNECTED TO +VS
*N = Plastic DIP: Q = Cerdip; R = Small Outline
IC (SOIC).
Figure 1.Input Voltage Swing
vs. Supply Voltage
Figure 4.Quiescent Current vs.
Supply Voltage
Figure 7.Input Bias Current vs.
AD845–Typical Characteristics

Common-Mode Voltage
Figure 2.Output Voltage Swing
vs. Supply Voltage
Figure 5.Input Bias Current vs.
Temperature
Figure 8.Short-Circuit Current
Limit vs. Temperature
Figure 3.Output Voltage Swing
vs. Resistive Load
Figure 6.Magnitude of Output
Impedance vs. Frequency
Figure 9.Unity-Gain Bandwidth
vs. Temperature
Figure 10.Open-Loop Gain and
Phase Margin vs. Frequency
Figure 13.Common-Mode
Rejection vs. Frequency
Figure 16.Harmonic Distortion
vs. Frequency
Figure 11.Open-Loop Gain vs.
Supply Voltage
Figure 14.Large Signal Frequency
Response
Figure 17.Input Noise Voltage
Spectral Density
Figure 12.Power Supply
Rejection vs. Frequency
Figure 15. Output Swing and
Error vs. Settling Time
Figure 18.Slew Rate vs. Temperature
AD845
Figure 19.Recommended Power
Supply Bypassing
Figure 22a.Unity-Gain Follower
Figure 23a.Unity-Gain Inverter
Figure 20.AD845 Simplified
Schematic
Figure 22b. Unity-Gain Follower
Large Signal Pulse Response
Figure 23b.Unity-Gain Inverter
Large Signal Pulse Response
Figure 21.Offset Null Configuration
Figure 22c.Unity-Gain Follower
Small Signal Pulse Response
Figure 23c.Unity-Gain Inverter
Small Signal Pulse Response
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