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AD8349ADN/a2avai800 MHz


AD8349 ,800 MHzAPPLICATIONS Cellular Communication Systems W-CDMA/CDMA/GSM/PCS/DCS Wireless LAN / Wireless Loca ..
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AD8349
800 MHz
PRELIMINARY TECHNICAL DATA
Rev. PrI 1/11/03
800 MHz – 2.7 GHz a Quadrature Modulator
FEATURES
Output Frequency Range 800 MHz – 2.7 GHz
Modulation Bandwidth DC-200 MHz
Output Level +2 dBm @ 2.1 GHz
Noise Floor –156 dBm/Hz
High Accuracy
Phase Quadrature Error 0.5 degree rms
Amplitude Balance 0.1 dB
Single Supply 4.5-5.5 V
107 mA Total Current
Output disable Function
Pin Compatible With AD8346 / AD8345
16-lead exposed paddle TSSOP package
APPLICATIONS
Cellular Communication Systems
W-CDMA/CDMA/GSM/PCS/DCS
Wireless LAN / Wireless Local Loop
Broadband Wireless Access Systems
PRODUCT DESCRIPTION
The AD8349 is a silicon monolithic RFIC quadrature modulator, designed for use from 0.8 to 2.7 GHz. Its
excellent phase accuracy and amplitude balance enable high performance direct RF modulation. The differential LO signal first passes through a polyphase
phase splitter. The I- and Q-channel outputs of the phase splitter are buffered to drive the LO inputs of two Gilbert-
cell mixers. Two differential V-to-I converters connected to the I- and Q-channel baseband inputs provide the tail
currents for the mixers. The outputs of the two mixers are summed together by a differential buffer to drive 50 ohm
loads. The device also features an output disable function.
The AD8349 can be used as a direct-to-RF transmit modulator
in digital communication systems such as GSM, CDMA, W-CDMA basestations and QPSK or QAM broadband wireless
access transmitters. It can also be used as the IF modulator within LMDS transmitters. Additionally, this quadrature modulator can be used with direct
digital synthesizers in hybrid phase-locked loops to generate signals over a wide frequency range with millihertz resolution. The AD8349 is supplied in a 16-lead exposed-paddle TSSOP
package. Its performance is specified over a -40 to +85 oC temperature range. This device is fabricated on Analog
Devices’ advanced Complementary Silicon Bipolar process.
PRELIMINARY TECHNICAL DATA AD8349-SPECIFICATIONS
(Vsupply = 5 V; Tambient = 25 °C; LO = 2.1 GHz, -2 dBm; Baseband I/Q inputs = 1.2 V p-p
differential swing with a 0.5 V DC bias. i.e. +0.5 V ±0.3 V on each baseband input pin;
Baseband frequency = 1 MHz; LO source & RF output load impedances are 50 Ω)
GHz dBm dBm dBm Ω dB dBm/Hz dBm dBc dBc
PRELIMINARY TECHNICAL DATA
ABSOLUTE MAXIMUM RATINGS*

Supply Voltage VPOS …………………...……….5.5 V
IBBN& IBBP……………………………..….TBD dBm
Equivalent Voltage ……………………….…TBD V
LOIN& LOIP…………………………………TBD dBm
Equivalent Voltage ………………………….TBD V
Internal Power Dissipation ….……………………..TBD
 θJA (Exposed Paddle Soldered Down) …………..30°C/W
θJA (Exposed Paddle not Soldered Down)……....95°C/W
Maximum Junction Temperature ……….…...….+125°C
Operating Temperature Range .………..-40° C to +85°C
Storage Temperature Range ……..…..-65° C to +150°C
Lead Temperature Range (Soldering 60 sec)…...+300°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
C A U T I O N E S D ( e l e c t r o s t a t i c d i s c h a r g e ) s e ns i t i v e d e v i ce . E le c tros tat ic ch a r g e s a s h ig h a s 400 0 V re ad ily c c u m ula t e o n t h e h u m a n b o d y a nd t e s t eq u ipm ent a n d c a n dis ch a r g e wi t h out d e tec t i on . h o ughh e 8 3 4 9 f e a t u r e s p r o p r i e t a r y E S D p r o t e c t i o n ci rcu i t r y , p e rmane n t da mage may o c c u r on e vi c e s s u b j c t e d t o h i g h e n erg y [ > T B D V H B M] e l ectr os ta t ic d is c har ges . Th erefo r e , p ro p er ES Dr e c a u t i ons a r e r e c o m m e n d e d t o a vo i d p e rfo r man c e d e g ra d a t io n or l os s of func tion ali t y . D EVI C E ORDERING GUIDE
PIN CONFIGURATION

IBBP
IBBN
COM3IN
LOIP
VPS1
ENOP
COM1
QBBP
QBBN
COM3
COM3
VPS2UT
COM2
COM4
PRELIMINARY TECHNICAL DATA
Pin Function Descriptions

PRELIMINARY TECHNICAL DATA
Evaluation Board
A populated AD8349 Evaluation Board is
available.
The AD8349 has an exposed paddle underneath the package. For thermal and electrical grounding reasons, this paddle is soldered to the
ground plane of the evaluation board. The AD8349-EVAL is designed without any
components on the underside of the board for ease of removal of the DUT.
Figure 1. Evaluation Board Schematic.
PRELIMINARY TECHNICAL DATATable I Evaluation Board Configuration Options OUTLINE DIMENSIONS
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