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AD8347ARUADIN/a500avai0.8 GHz-2.7 GHz Direct Conversion Quadrature Demodulator


AD8347ARU ,0.8 GHz-2.7 GHz Direct Conversion Quadrature DemodulatorSPECIFICATIONS R = 10 k, dBm with respect to 50 , unless otherwise noted.)LOADParameter Condition ..
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AD8347ARU
0.8 GHz-2.7 GHz Direct Conversion Quadrature Demodulator
REV.0
0.8 GHz–2.7 GHz
Direct Conversion Quadrature Demodulator
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Integrated RF and Baseband AGC Amplifiers
Quadrature Phase Accuracy 1� Typ
I/Q Amplitude Balance 0.3 dB Typ
Third Order Intercept (IIP3) +11.5 dBm @ Min Gain
Noise Figure 11 dB @ Max Gain
AGC Range 69.5 dB
Baseband Level Control Circuit
Low LO Drive –8 dBm
ADC Compatible I/Q Outputs
Single Supply 2.7 V–5.5 V
Power-Down Mode
Package 28-Lead TSSOP
APPLICATIONS
Cellular Basestations
Radio Links
Wireless Local Loop
IF Broadband Demodulator
RF Instrumentation
Satellite Modems
GENERAL DESCRIPTION

The AD8347 is a broadband Direct Quadrature Demodulator
with RF and baseband Automatic Gain Control (AGC) amplifiers.
It is suitable for use in many communications receivers,
performing Quadrature demodulation directly to baseband
frequencies. The input frequency range is 800 MHz to 2.7 GHz.
The outputs can be connected directly to popular A-to-D converters
such as the AD9201 and AD9283.
The RF input signal goes through two stages of variable gain
amplifiers prior to two Gilbert-cell Mixers. The LO quadrature
phase splitter employs polyphase filters to achieve high quadra-
ture accuracy and amplitude balance over the entire operating
frequency range. Separate I & Q channel variable-gain amplifiers
follow the baseband outputs of the mixers. The RF and baseband
amplifiers together provide 69.5 dB of gain control. A precision
control circuit sets the Linear-in-dB RF gain response to the gain
control voltage.
Baseband level detectors are included for use in an AGC loop to
maintain the output level. The demodulator dc offsets are
minimized by an internal loop, whose time constant is controlled
by external capacitor values. The offset control can also be
overridden by forcing an external voltage at the offset nulling pins.
The baseband variable gain amplifier outputs are brought off-chip
for filtering before final amplification. By inserting a channel
selection filter before each output amplifier high-level out-of-
channel interferers can be eliminated. Additional internal circuitry
also allows the user to set the dc common-mode level at the
baseband outputs.
*U.S. Patents Issued and Pending
AD8347–SPECIFICATIONS
(VS = 5 V; TA = 25�C; FLO = 1.9 GHz; VVCMO = 1 V; FRF = 1.905 GHz; PLO = –8 dBm,
RLOAD = 10 k�, dBm with respect to 50 �, unless otherwise noted.)
AD8347
RESPONSE FROM RF INPUT TO
FINAL BB AMP
LO/RF INPUT
Specifications subject to change without notice.
AD8347
ABSOLUTE MAXIMUM RATINGS*

Supply Voltage VPS1, VPS2, VPS3 . . . . . . . . . . . . . . . . . . . 5.5 V
LO and RF Input Power . . . . . . . . . . . . . . . . . . . . . . 10 dBm
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 500 mW
�JA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8347 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
RFIN
VREF
RFIP
VPS2IMXO
COM3
IOPPIOFSIOPN
VPS1
LOIN
IAIN
COM2
QOPN
COM3VGIN
ENBL
LOIP
COM1
VPS3
VCMO
VDT2QMXOQOPPQOFSVAGCVDT1QAIN

Figure 1.Block Diagram
PIN CONFIGURATION
PIN FUNCTION DESCRIPTIONS
18, 20
25, 26
AD8347
EQUIVALENT CIRCUITS

Figure 2.Equivalent Circuits
Circuit A
Circuit D
Circuit G
Circuit B
Circuit E
Circuit H
Circuit C
Circuit F
Circuit I
RF AMP AND DEMODULATOR
TPC 1.Gain and Linearity Error vs. VGIN, VS = 5 V,
FLO = 1900 MHz, FBB = 1 MHz
TPC 2.Gain and Linearity Error vs. VGIN, VS = 2.7 V,
FLO = 1900 MHz, FBB = 1 MHz
TPC 3.Gain vs. FLO, VGIN = 0.2 V , FBB = 1 MHz
TPC 4.Gain vs. FLO, VGIN = 0.7 V, FBB = 1 MHz
TPC 5.Gain vs. FLO, VGIN = 1.2 V, FBB = 1 MHz
TPC 6.Gain vs. FBB, VGIN = 0.2 V, FLO = 1900 MHz
AD8347
TPC 7.Gain vs. FBB, VGIN = 0.7 V, FLO = 1900 MHz
TPC 8.Gain vs. FBB, VGIN = 1.2 V, FLO = 1900 MHz
TPC 9.Input 1 dB Compression Point (OP1 dB) vs. VGIN,
FLO = 1900 MHz, FBB = 1 MHz
TPC 10.IIP3 vs. FLO, VGIN = 1.2 V, FBB = 1 MHz
TPC 11.IIP3 vs. FLO, VGIN = 0.2 V, FBB = 1 MHz,
TPC 12.IIP3 vs. FBB, VGIN = 1.2 V, FLO = 1900 MHz
TPC 13.IIP3 vs. FBB, VGIN = 0.2 V, FLO = 1900 MHz
TPC 14.IIP2 vs. FLO, VGIN = 1.2 V, Baseband
Tone1 = 5 MHz, –10 dBm, Baseband Tone2 = 6 MHz,
–10 dBm, Temperature = 25�C, VS = 5 V
TPC 15.Noise Figure vs. LO Frequency (FLO),
Temperature = 25�C, VGIN = 0.2 V, FBB = 1 MHz
TPC 16.Noise Figure and IIP3 vs. VGIN,
Temperature = 25�C, FLO = 1900 MHz, FBB = 1 MHz
TPC 17a.Quadrature Error vs. LO Power Level,
Temperature = 25�C, VGIN = 0.2 V, VS = 5 V
TPC 17b.Noise Figure vs. LO Input Level,
Temperature = 25�C, VGIN = 0.2 V, VS = 5 V
AD8347
BASEBAND OUTPUT AMPLIFIERS

TPC 18. Gain vs. FBB, VVCMO = 1 V
TPC 19.OP1 vs. FBB, VVCMO = 1 V
TPC 20.OIP3 vs. FBB, VVCMO = 1 V
TPC 21.Common-Mode Output Offset Voltage vs. VVCMO,
Temperature = 25�C (� = 1 Standard Deviation)
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