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AD53033JSTPADIN/a2avaiDRIVER/COMPARATOR: High Performance Driver/Comparator on a Single Chip


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AD53033JSTP
DRIVER/COMPARATOR: High Performance Driver/Comparator on a Single Chip
REV.0
High Performance Driver/Comparator
on a Single Chip
FUNCTIONAL BLOCK DIAGRAM
COMPARATOR
50V
1.0mA/K
VCCVCCVCCVEEVEEVEEVEE5239404132
AD53033
VOUT
VLDCPL
2, 5, 89, 33, 44, 46, 48
PWRGNDECLGNDHQGND2
THERMVH
VTERM
DATA
IOD
RLD
HCOMP
LEH
QHB
LEL
LCOMP
NC = NO CONNECT
DATAB
IODB
RLDB
LEHB
QLB
LELB
VHDCPL
FEATURES
250 MHz Operation
Driver/Comparator Included
52-Lead LQFP Package with Built-in Heat Sink
APPLICATIONS
Automatic Test Equipment
Semiconductor Test Systems
Board Test Systems
Instrumentation and Characterization Equipment
PRODUCT DESCRIPTION

The AD53033 is a single chip that performs the pin electronics
functions of driver and comparator (D-C) in ATE VLSI and
memory testers.
The driver is a proprietary design that features three active
states: Data High Mode, Data Low Mode and Term Mode as
well as an Inhibit State. This facilitates the implementation of
high speed active termination. The output voltage range is –3 V
to +8 V to accommodate a wide variety of test devices. The
output leakage is typically less than 250 nA over the entire sig-
nal range.
The dual comparator, with an input range equal to the driver
output range, features built-in latches and ECL-compatible
outputs. The outputs are capable of driving 50 W signal lines
terminated to –2 V. Signal tracking capability is upwards of
5 V/ns.
Also included on the chip is an onboard temperature sensor
whose purpose is to give an indication of the surface tempera-
ture of the D-C. This information can be used to measure qJC
and qJA or flag an alarm if proper cooling is lost. Output from the
sensor is a current sink that is proportional to absolute tempera-
ture. The gain is trimmed to a nominal value of 1.0 mA/K. As
an example, the output current can be sensed by using a 10 kW
resistor connected from +10 V to the THERM (IOUT) pin. A
voltage drop across the resistor will be developed that equals:
10K · 1 mA/K = 10 mV/K = 2.98 V at room temperature.
AD53033–SPECIFICATIONS
DRIVER SPECIFICATIONS
(All specifications are at TJ = +858C 6 58C, +VS = +12 V 6 3%, –VS = –7 V = 63% unless otherwise noted. All temperature coefficients are
measured at TJ = +758C to +958C). CHDCPL = CLDCPL = 39 nF.
AD53033
DYNAMIC PERFORMANCE, INHIBIT
DYNAMIC PERFORMANCE , VTERM
Specifications subject to change without notice.
COMPARATOR SPECIFICATIONS
(All specifications are at TJ = +858C 6 58C, +VS = +12 V 6 3%, –VS = –7 V = 63% unless otherwise noted. All temperature coefficients are
measured at TJ = +758C to +958C).

LATCH ENABLE INPUTS
DIGITAL OUTPUTS
SWITCHING PERFORMANCE
AD53033–SPECIFICATIONS
TOTAL FUNCTION SPECIFICATIONS
(All specifications are at TJ = +858C 6 58C, +VS = +12 V 6 3%, –VS = –7 V = 63% unless otherwise noted. All temperature coefficients are
measured at TJ = +758C to +958C).

NOTES
Connecting or shorting the decoupling pins to ground will result in the destruction of the device.
Specifications subject to change without notice.
Table I.Driver Truth Table
Table II.Comparator Truth Table
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD53033 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS1

Power Supply Voltage
+VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+13 V
–VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–8 V
+VS to –VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+20 V
PWR GND to ECL GND or HQ GND . . . . . . . . . .–0.4 V
Inputs
DATA, DATA, IOD, IOD, RLD, RLD . . . . . .+5 V, –3 V
DATA to DATA, IOD to IOD, RLD to RLD . . . . . . .–3 V
LEL, LEL, LEH, LEH . . . . . . . . . . . . . . . . . . .+5 V, –3 V
LEL to LEL, LEH to LEH . . . . . . . . . . . . . . . . . . . . .–3 V
VH, VL, VTERM to GND . . . . . . . . . . . . . . . .+9 V, –4 V
VH to VL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–11 V
(VH – VTERM) and (VTERM – VL) . . . . . . . . . . . .–11 V
HCOMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+9 V, –4 V
LCOMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+9 V, –4 V
HCOMP, LCOMP to VOUT . . . . . . . . . . . . . . . . . . .–11 V
Outputs
VOUT Short Circuit Duration . . . . . . . . . . . . . . . .Indefinite2
VOUT Inhibit Mode . . . . . . . . . . . . . . . . . . . . . . .+9 V, –4 V
VHDCPL . . . . . . . .Do Not Connect Except for Cap to VCC
VLDCPL . . . . . . . .Do Not Connect Except for Cap to VEE
QH, QH, QL, QL Maximum IOUT
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA
Surge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
THERM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+13 V, 0 V
Environmental
Operating Temperature (Junction) . . . . . . . . . . . . . .+175°C
Storage Temperature . . . . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec)3 . . . . . . . . . .+260°C
NOTESStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Absolute maximum limits apply
individually, not in combination. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.Output short circuit protection to ground is guaranteed as long as proper heat
sinking is employed to ensure compliance with the operating temperature limits.To ensure lead coplanarity (–0.002 inches) and solderability, handling with bare
hands should be avoided and the device should be stored in environments at 24°C5°C (75°F – 10°F) with relative humidity not to exceed 65%.
Table III.Package Thermal Characteristics
ORDERING GUIDE
AD53033
C3517–2–2/99
PRINTED IN U.S.A.
PIN CONFIGURATION
THERM
HCOMP
LCOMP
VHDCPL
HQGND2
OUT
VLDCPL
ECLGND
ECLGND
ECLGND
PWRGND
LEL
LEH
VEE
DATA
PWRGND
VEEVCCPIN 1
IDENTIFIER
HEAT SINK UP
(Not to Scale)
AD53033
RLDPWRGNDVHPWRGNDVTERMPWRGNDIODV
QLB
QHB
LELB
LEHBNCNCNCNC
DATAB
IODBRLDB
NC = NO CONNECT
52-Lead LQFP–EDQUAD with Integral Heat Slug
(SQ-52)
TOP VIEW
(PINS DOWN)
SEATING
PLANE
0.063 (1.60)
MAX
STANDOFF
0.004 (0.10)
MAX
0.039 (1.00)
BSC
0.008 (0.20)
0.004 (0.09)
CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED
OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).
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