| Features• Designed for Low Voltage Operation: V = 1.65−3.6 VCC1• 3.6 V Tolerant Inputs and Outputs• High Speed Operation: 2.5 ns max for 3.0 to 3.6 VA = Assembly Location3.0 ns max for 2.3 to 2.7 V WL = Wafer LotYY = Year6.0 ns max for 1.65 to 1.95 VWW = Work Week• Static Drive: ±24 mA Drive at 3.0 V±18 mA Drive at 2.3 V±6 mA Drive at 1.65 VORDERING INFORMATION• Supports Live Insertion and Withdrawal†Device Package Shipping• Includes Active Bushold to Hold Unused or Floating Inputs at a ValidLogic State74VCXH16245DT TSSOP 39 / Rail*• I Specification Guarantees High Impedance When V = 0 VOFF CC74VCXH16245DTR TSSOP 2500/Tape & Reel• Near Zero Static Supply Current in All Three Logic States (20 A)74VCXH16245DTRG TSSOP 2500/Tape & ReelSubstantially Reduces System Power Requirements(Pb−Free)• Latchup Performance Exceeds ±250 mA @ 125°C†For information on tape and reel specifications,• ESD Performance: Human Body Model >2000 V;including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specification Machine Model >200 VBrochure, BRD8011/D.• Pb−Free Package is Available**NOTE: To ensure the outputs activate in the 3−state condition, *For additional information on our Pb−Free strategy the output enable pins should be connected to V through a CCand soldering details, please download thepull−up resistor. The value of the resistor is determined by the ON Semiconductor Soldering and Mountingcurrent sinking capability of the output connected to the OE pin.Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 20041 Publication Order Number:May, 2004 − Rev. 3 74VCXH16245/D74VCXH162451 24T/R1 T/R2T/R1 1 48 OE1B0 2 47 A048 25OE1 OE2B1 3 46 A1GND 4 45 GNDB2 5 44 A2A0:7 B0:7 A8:15 B8:15B36A 433V 7 42 VCC CCB4 8 41 A4B5 9 40 A5One of EightGND 10 39 GNDFigure 2. |
