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74LVC1G332GFPHIN/a2750avaiSingle 3-input OR gate
74LVC1G332GWNXPN/a3000avaiSingle 3-input OR gate


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74LVC1G332GF-74LVC1G332GW
Single 3-input OR gate
1. General description
The 74LVC1G332 provides one 3-input OR function.
Inputs can be driven from either 3.3 V or5 V devices. This feature allows the use of these
devices as translators in mixed 3.3 V and5 V applications.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall
time.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65Vto 5.5V High noise immunity Complies with JEDEC standard: JESD8-7 (1.65Vto 1.95V) JESD8-5 (2.3Vto 2.7V) JESD8B/JESD36 (2.7Vto 3.6V) ESD protection: HBM JESD22-A114F exceeds 2000V MM JESD22-A115-A exceeds 200V CDM JESD22-C101-C exceeds 1000V 24 mA output drive (VCC =3.0V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5V Multiple package options Specified from 40 C to +85 C and 40 C to +125C
74L VC1G332
Single 3-input OR gate
Rev. 4 — 6 December 2011 Product data sheet
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
3. Ordering information

4. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram

Table 1. Ordering information

74LVC1G332GW 40 Cto+125C SC-88 plastic surface-mounted package; 6 leads SOT363
74LVC1G332GV 40 C to +125 C SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
74LVC1G332GM 40 Cto+125C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body1 1.45 0.5 mm
SOT886
74LVC1G332GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 11 0.5 mm
SOT891
74LVC1G332GN 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 0.9 1.0 0.35 mm
SOT1115
74LVC1G332GS 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 1.0 1.0 0.35 mm
SOT1202
Table 2. Marking

74LVC1G332GW YG
74LVC1G332GV YG
74LVC1G332GM YG
74LVC1G332GF YG
74LVC1G332GN YG
74LVC1G332GS YG
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
6. Pinning information
6.1 Pinning

6.2 Pin description

7. Functional description

[1] H= HIGH voltage level;= LOW voltage level;= don’t care.
Table 3. Pin description
1 data input
GND 2 ground (0V) 3 data input 4 data output
VCC 5 supply voltage 6 data input
Table 4. Function table[1]
X H XH H H LL
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC=0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For SC-88 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
VCC supply voltage 0.5 +6.5 V
IIK input clamping current VI < 0 V 50 - mA input voltage [1] 0.5 +6.5 V
IOK output clamping current VO > VCC or VO < 0 V - 50 mA output voltage Active mode [1][2] 0.5 VCC + 0.5 V
Power-down mode [1][2] 0.5 +6.5 V output current VO = 0 V to VCC - 50 mA
ICC supply current - 100 mA
IGND ground current 100 - mA
Ptot total power dissipation Tamb= 40 C to +125C [3]- 250 mW
Tstg storage temperature 65 +150 C
Table 6. Recommended operating conditions

VCC supply voltage 1.65 - 5.5 V input voltage 0 - 5.5 V output voltage Active mode 0 - VCC V
VCC = 0 V; Power-down mode 0 - 5.5 V
Tamb ambient temperature 40 - +125 C
t/V input transition rise and fall rate VCC = 1.65 V to 2.7 V - - 20 ns/V
VCC = 2.7 V to 5.5 V - - 10 ns/V
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
10. Static characteristics

[1] All typical values are measured at VCC=3.3 V and Tamb =25C.
Table 7. Static characteristics

At recommended operating conditions. Voltages are referenced to GND (ground=0V).
VIH HIGH-level
input voltage
VCC = 1.65 V to 1.95 V 0.65VCC - - 0.65VCC -V
VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V
VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V
VCC = 4.5 V to 5.5 V 0.7VCC -- 0.7VCC -V
VIL LOW-level
input voltage
VCC = 1.65 V to 1.95 V - - 0.35VCC -0.35VCC V
VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V
VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V
VCC = 4.5 V to 5.5 V - - 0.3VCC -0.3VCC V
VOH HIGH-level
output voltage =VIHorVIL= 100 A;
VCC= 1.65 V to 5.5V
VCC 0.1 - - VCC 0.1 - V= 4mA; VCC = 1.65V 1.2 - - 0.95 - V= 8mA; VCC = 2.3V 1.9 - - 1.7 - V= 12 mA; VCC = 2.7 V 2.2 - - 1.9 - V= 24 mA; VCC = 3.0 V 2.3 - - 2.0 - V= 32 mA; VCC = 4.5 V 3.8 - - 3.4 - V
VOL LOW-level
output voltage =VIHorVIL= 100 A;
VCC= 1.65V to 5.5 V 0.1 - 0.1 V =4mA; VCC = 1.65V - - 0.45 - 0.70 V =8mA; VCC = 2.3V - - 0.3 - 0.45 V =12mA; VCC = 2.7 V - - 0.4 - 0.60 V =24mA; VCC = 3.0 V - - 0.55 - 0.80 V =32mA; VCC = 4.5 V - - 0.55 - 0.80 V input leakage
current
VCC = 0 V to 5.5 V; =5.5V orGND 0.1 5- 100 A
IOFF power-off
leakage
current
VCC = 0 V; VIorVO =5.5V - 0.1 10 - 200 A
ICC supply current VCC = 1.65 V to 5.5 V; =VCCor GND; IO =0A
-0.1 10 - 200 A
ICC additional
supply current
per pin; VCC = 2.3 V to 5.5 V; =VCC 0.6 V; IO =0 A 5 500 - 5000 A input
capacitance
VCC =3.3 V; VI = GND to
VCC - - - pF
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
11. Dynamic characteristics

[1] Typical values are measured at Tamb =25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2] tpd is the same as tPLH and tPHL.
[3] CPD is used to determine the dynamic power dissipation (PDin W). =CPD VCC2fi N+ (CL VCC2fo) where:= input frequency in MHz;= output frequency in MHz;= output load capacitance inpF;
VCC= supply voltage in V;= number of inputs switching;
(CL VCC2fo)= sum of outputs.
12. AC waveforms

Table 8. Dynamic characteristics

Voltages are referenced to GND (ground=0 V); for load circuit see Figure8.
tpd propagation delay A,B andCto Y; see Figure7 [2]
VCC= 1.65 V to 1.95V 1.5 4.7 17.2 1.5 21.5 ns
VCC= 2.3 V to 2.7V 1.0 3.0 6.2 1.0 7.8 ns
VCC= 2.7V 1.0 3.0 6.0 1.0 7.5 ns
VCC= 3.0 V to 3.6V 1.0 2.6 4.8 1.0 6.2 ns
VCC= 4.5 V to 5.5V 1.0 1.9 3.5 1.0 4.4 ns
CPD power dissipation
capacitance
VI = GND to VCC; VCC =3.3 V [3] -12- - - pF
NXP Semiconductors 74LVC1G332
Single 3-input OR gate

Table 9. Measurement points

1.65 V to 1.95V 0.5VCC 0.5VCC
2.3 V to 2.7V 0.5VCC 0.5VCC
2.7V 1.5V 1.5V
3.0V to 3.6V 1.5V 1.5V
4.5 V to 5.5V 0.5VCC 0.5VCC
Table 10. Test data

1.65 V to 1.95V VCC  2.0ns 30pF 1k open
2.3 V to 2.7V VCC  2.0ns 30pF 500 open
2.7V 2.7V  2.5ns 50pF 500 open
3.0V to 3.6V 2.7V  2.5ns 50pF 500 open
4.5 V to 5.5V VCC  2.5ns 50pF 500 open
NXP Semiconductors 74LVC1G332
Single 3-input OR gate
13. Package outline

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