74LCXZ16244MEAX ,Low Voltage 16-Bit Buffer/Line Driver with 5V Tolerant Inputs and Outputsapplications with capability of interfacing to a 5V signalCC Machine model > 200Venvironment. Also ..
74LCXZ16245 ,Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputsapplications.
74LCXZ16244MEAX
Low Voltage 16-Bit Buffer/Line Driver with 5V Tolerant Inputs and Outputs
74LCXZ16244 Low Voltage 16-Bit Buffer/Line Driver with 5V Tolerant Inputs and Outputs September 2000 Revised August 2001 74LCXZ16244 Low Voltage 16-Bit Buffer/Line Driver with 5V Tolerant Inputs and Outputs General Description Features The LCXZ16244 contains sixteen non-inverting buffers � 5V tolerant inputs and outputs with 3-STATE outputs designed to be employed as a mem- � Guaranteed power up/down high impedance ory and address driver, clock driver, or bus oriented trans- � Supports live insertion/withdrawal mitter/receiver. The device is nibble controlled. Each nibble � 2.7V–3.6V V specifications provided CC has separate 3-STATE control inputs which can be shorted together for full 16-bit operation. � 4.5 ns t max (V = 3.0V), 20 µA I max PD CC CC When V is between 0 and 1.5V, the LCXZ12644 is in the CC � ±24 mA output drive (V = 3.0V) CC high impedance state during power up or power down. This � Implements patented noise/EMI reduction circuitry places the outputs in high impedance (Z) state preventing � Latch-up performance exceeds 500 mA intermittent low impedance loading or glitching in bus ori- ented applications. � ESD performance: Human body model > 2000V The LCXZ16244 is designed for low voltage (2.7V or 3.3V) V applications with capability of interfacing to a 5V signal CC Machine model > 200V environment. � Also packaged in plastic Fine-Pitch Ball Grid Array The LCXZ16244 is fabricated with an advanced CMOS (FBGA) (Preliminary) technology to achieve high speed operation while maintain- ing CMOS low power dissipation. Ordering Code: Order Number Package Number Package Description 74LCXZ16244GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [TAPE and REEL] 74LCXZ16244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LCXZ16244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2001 DS500252
