74LCXH16373 ,Low Voltage 16-Bit Transparent Latch with Busholdapplications with capability of interfacing to a 5V signalCC Latch-up performance exceeds 500 mAen ..
74LCXH16374 ,Low Voltage 16-Bit D-Type Flip-Flop with Busholdapplications.
74LCXH16373
Low Voltage 16-Bit Transparent Latch with Bushold
74LCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold February 2001 Revised August 2001 74LCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold General Description Features The LCXH16373 contains sixteen non-inverting latches � 5V tolerant control inputs and outputs with 3-STATE outputs and is intended for bus oriented � 2.3V–3.6V V specifications provided CC applications. The device is byte controlled. The flip-flops � 5.4 ns t max (V = 3.3V), 20 µA I max PD CC CC appear transparent to the data when the Latch Enable (LE) is HIGH. When LE is LOW, the data that meets the setup � Bushold on inputs eliminates the need for external time is latched. Data appears on the bus when the Output pull-up/pull-down resistors Enable (OE) is LOW. When OE is HIGH, the outputs are in � Power down high impedance outputs a high impedance state. � ±24 mA output drive (V = 3.0V) CC The LCXH16373 is designed for low voltage (2.5V or 3.3V) � Implements patented noise/EMI reduction circuitry V applications with capability of interfacing to a 5V signal CC � Latch-up performance exceeds 500 mA environment. � ESD performance: The LCXH16373 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- Human body model > 2000V ing CMOS low power dissipation. Machine model > 200V The LCXH16373 data inputs include active bushold cir- � Also available in plastic Fine-Pitch Ball Grid Array cuitry, eliminating the need for external pull-up resistors to (FBGA) (Preliminary) hold unused or floating data input at a valid logic level. Ordering Code: Order Number Package Number Package Description 74LCXH16373GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [TAPE and REEL] 74LCXH16373MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LCXH16373MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2001 DS500440
