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74AUP1G58GMPHIN/a5000avaiLow-power configurable multiple function gate


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74AUP1G58GM
Low-power configurable multiple function gate
1. General description
The 74AUP1G58 provides configurable multiple functions. The output state is determined
by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,
NOR, XOR, inverter and buffer. All inputs can be connected to VCC or GND.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74AUP1G58 has Schmitt trigger inputs making it capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals.
The inputs switch at different points for positive and negative-going signals. The difference
between the positive voltage VT+ and the negative voltage VT is defined as the input
hysteresis voltage VH.
2. Features and benefits
Wide supply voltage range from 0.8 Vto 3.6V High noise immunity ESD protection: HBM JESD22-A114F exceeds 5000V MM JESD22-A115-A exceeds 200V CDM JESD22-C101E exceeds 1000V Low static power consumption; ICC = 0.9 A (maximum) Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6V Low noise overshoot and undershoot < 10 % of VCC IOFF circuitry provides partial power-down mode operation Multiple package options Specified from 40 Cto+85 C and 40 Cto+125C
74AUP1G58
Low-power configurable multiple function gate
Rev. 6 — 15 August 2012 Product data sheet
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
3. Ordering information

4. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram

Table 1. Ordering information

74AUP1G58GW 40 C to +125 C SC-88 plastic surface-mounted package; 6 leads SOT363
74AUP1G58GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 1 1.45 0.5 mm
SOT886
74AUP1G58GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 11 0.5 mm
SOT891
74AUP1G58GN 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 0.9 1.0 0.35 mm
SOT1115
74AUP1G58GS 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 1.0 1.0 0.35 mm
SOT1202
Table 2. Marking

74AUP1G58GW aK
74AUP1G58GM aK
74AUP1G58GF aK
74AUP1G58GN aK
74AUP1G58GS aK
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
6. Pinning information
6.1 Pinning

6.2 Pin description

7. Functional description

[1] H= HIGH voltage level; L= LOW voltage level.
Table 3. Pin description
1 data input
GND 2 ground (0V) 3 data input 4 data output
VCC 5 supply voltage 6 data input
Table 4. Function table[1]
LL H H LL H H L H HH L L HL
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
7.1 Logic configurations

Table 5. Function selection table

2-input NAND see Figure5
2-input NAND with both inputs inverted see Figure8
2-input AND with inverted input see Figure 6 and Figure7
2-input NOR with inverted input see Figure 6 and Figure7
2-input OR see Figure8
2-input OR with both inputs inverted see Figure5
2-input XOR see Figure9
Buffer see Figure10
Inverter see Figure11
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate

8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For SC-88 packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
VCC supply voltage 0.5 +4.6 V
IIK input clamping current VI <0V 50 - mA input voltage [1] 0.5 +4.6 V
IOK output clamping current VO <0V 50 - mA output voltage Active mode and Power-down mode [1] 0.5 +4.6 V output current VO =0 VtoVCC - 20 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb= 40 C to +125C [2] -250 mW
Table 7. Recommended operating conditions

VCC supply voltage 0.8 3.6 V input voltage 0 3.6 V output voltage Active mode 0 VCC V
Power-down mode; VCC =0V 0 3.6 V
Tamb ambient temperature 40 +125 C
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
10. Static characteristics
Table 8. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground=0V).
Tamb = 25 C

VOH HIGH-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V VCC  0.1 - - V
IO = 1.1 mA; VCC = 1.1 V 0.75  VCC -- V
IO = 1.7 mA; VCC = 1.4 V 1.11 - - V
IO = 1.9 mA; VCC = 1.65 V 1.32 - - V
IO = 2.3 mA; VCC = 2.3 V 2.05 - - V
IO = 3.1 mA; VCC = 2.3 V 1.9 - - V
IO = 2.7 mA; VCC = 3.0 V 2.72 - - V
IO = 4.0 mA; VCC = 3.0 V 2.6 - - V
VOL LOW-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.1 V
IO = 1.1 mA; VCC = 1.1 V - - 0.3  VCC V
IO = 1.7 mA; VCC = 1.4 V - - 0.31 V
IO = 1.9 mA; VCC = 1.65 V - - 0.31 V
IO = 2.3 mA; VCC = 2.3 V - - 0.31 V
IO = 3.1 mA; VCC = 2.3 V - - 0.44 V
IO = 2.7 mA; VCC = 3.0 V - - 0.31 V
IO = 4.0 mA; VCC = 3.0 V - - 0.44 V input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.1 A
IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.2 A
IOFF additional power-off leakage
current
VI or VO = 0 V to 3.6 V;
VCC =0Vto0.2V 0.2 A
ICC supply current VI = GND or VCC; IO = 0A;
VCC= 0.8Vto 3.6V 0.5 A
ICC additional supply current VI = VCC  0.6 V; IO = 0A;
VCC =3.3V 40 A input capacitance VI = GND or VCC; VCC = 0 V to 3.6 V - 1.1 - pF output capacitance VO = GND; VCC = 0 V - 1.8 - pF
Tamb = 40 C to +85
C
VOH HIGH-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V VCC  0.1 - - V
IO = 1.1 mA; VCC = 1.1 V 0.7  VCC -- V
IO = 1.7 mA; VCC = 1.4 V 1.03 - - V
IO = 1.9 mA; VCC = 1.65 V 1.30 - - V
IO = 2.3 mA; VCC = 2.3 V 1.97 - - V
IO = 3.1 mA; VCC = 2.3 V 1.85 - - V
IO = 2.7 mA; VCC = 3.0 V 2.67 - - V
IO = 4.0 mA; VCC = 3.0 V 2.55 - - V
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate

VOL LOW-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.1 V
IO = 1.1 mA; VCC = 1.1 V - - 0.3  VCC V
IO = 1.7 mA; VCC = 1.4 V - - 0.37 V
IO = 1.9 mA; VCC = 1.65 V - - 0.35 V
IO = 2.3 mA; VCC = 2.3 V - - 0.33 V
IO = 3.1 mA; VCC = 2.3 V - - 0.45 V
IO = 2.7 mA; VCC = 3.0 V - - 0.33 V
IO = 4.0 mA; VCC = 3.0 V - - 0.45 V input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.5 A
IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.5 A
IOFF additional power-off leakage
current
VI or VO = 0 V to 3.6 V;
VCC =0Vto0.2V 0.6 A
ICC supply current VI = GND or VCC; IO = 0A;
VCC= 0.8Vto 3.6V 0.9 A
ICC additional supply current VI = VCC  0.6 V; IO = 0A;
VCC =3.3V 50 A
Tamb = 40 C to +125
C
VOH HIGH-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V VCC  0.11- - V
IO = 1.1 mA; VCC = 1.1 V 0.6  VCC -- V
IO = 1.7 mA; VCC = 1.4 V 0.93 - - V
IO = 1.9 mA; VCC = 1.65 V 1.17 - - V
IO = 2.3 mA; VCC = 2.3 V 1.77 - - V
IO = 3.1 mA; VCC = 2.3 V 1.67 - - V
IO = 2.7 mA; VCC = 3.0 V 2.40 - - V
IO = 4.0 mA; VCC = 3.0 V 2.30 - - V
VOL LOW-level output voltage VI = VT+ or VT
IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.11 V
IO = 1.1 mA; VCC = 1.1 V - - 0.33  VCCV
IO = 1.7 mA; VCC = 1.4 V - - 0.41 V
IO = 1.9 mA; VCC = 1.65 V - - 0.39 V
IO = 2.3 mA; VCC = 2.3 V - - 0.36 V
IO = 3.1 mA; VCC = 2.3 V - - 0.50 V
IO = 2.7 mA; VCC = 3.0 V - - 0.36 V
IO = 4.0 mA; VCC = 3.0 V - - 0.50 V input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.75 A
IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.75 A
Table 8. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground=0V).
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
11. Dynamic characteristics

IOFF additional power-off leakage
current
VI or VO = 0 V to 3.6 V;
VCC =0Vto0.2V 0.75 A
ICC supply current VI = GND or VCC; IO = 0A;
VCC= 0.8Vto 3.6V 1.4 A
ICC additional supply current VI = VCC  0.6 V; IO = 0A;
VCC =3.3V 75 A
Table 8. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground=0V).
Table 9. Dynamic characteristics

Voltages are referenced to GND (ground=0 V); for test circuit see Figure 13.
CL = 5 pF

tpd propagation delay A,B andCtoY;
see Figure12
[2]
VCC = 0.8 V - 22.8 - - - - ns
VCC = 1.1 V to 1.3 V 2.8 6.6 12.9 2.6 13.1 13.3 ns
VCC = 1.4 V to 1.6 V 2.4 4.8 7.6 2.4 8.3 8.6 ns
VCC = 1.65 V to 1.95 V 2.1 4.0 6.3 2.0 6.9 7.3 ns
VCC = 2.3 V to 2.7 V 2.0 3.2 4.6 1.8 5.1 5.4 ns
VCC = 3.0 V to 3.6 V 1.9 2.9 3.9 1.6 4.2 4.4 ns
CL = 10 pF

tpd propagation delay A,B andCtoY;
see Figure12
[2]
VCC = 0.8 V - 26.4 - - - - ns
VCC = 1.1 V to 1.3 V 3.2 7.4 14.5 3.0 14.9 15.2 ns
VCC = 1.4 V to 1.6 V 2.7 5.4 8.7 2.7 9.4 9.8 ns
VCC = 1.65 V to 1.95 V 2.5 4.5 7.1 2.3 7.9 8.3 ns
VCC = 2.3 V to 2.7 V 2.4 3.8 5.3 2.2 5.9 6.2 ns
VCC = 3.0 V to 3.6 V 2.3 3.5 4.6 1.9 4.9 5.1 ns
CL = 15 pF

tpd propagation delay A,B andCtoY;
see Figure12
[2]
VCC = 0.8 V - 29.9 - - - - ns
VCC = 1.1 V to 1.3 V 3.6 8.3 16.1 3.3 16.7 17.0 ns
VCC = 1.4 V to 1.6 V 3.0 5.9 9.7 3.0 10.5 11.0 ns
VCC = 1.65 V to 1.95 V 2.8 5.0 7.9 2.5 8.7 9.2 ns
VCC = 2.3 V to 2.7 V 2.7 4.2 5.9 2.5 6.6 6.9 ns
VCC = 3.0 V to 3.6 V 2.5 3.9 5.2 2.2 5.5 5.8 ns
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate

[1] All typical values are measured at nominal VCC.
[2] tpd is the same as tPLH and tPHL.
[3] All specified values are the average typical values over all stated loads.
[4] CPD is used to determine the dynamic power dissipation (PD in W). =CPD VCC2fi N+ (CL VCC2 fo) where:= input frequency in MHz;= output frequency in MHz;= load capacitance in pF;
VCC= supply voltage in V;= number of inputs switching;
(CL VCC2fo)= sum of the outputs.
CL = 30 pF

tpd propagation delay A,B andCtoY;
see Figure12
[2]
VCC = 0.8 V - 38.0 - - - - ns
VCC = 1.1 V to 1.3 V 4.5 10.5 20.8 4.1 21.9 24.1 ns
VCC = 1.4 V to 1.6 V 3.8 7.5 12.2 3.8 13.5 14.1 ns
VCC = 1.65 V to 1.95 V 3.4 6.3 10.0 3.1 11.2 11.9 ns
VCC = 2.3 V to 2.7 V 3.4 5.3 7.5 3.1 8.4 8.9 ns
VCC = 3.0 V to 3.6 V 3.3 5.0 6.6 2.9 7.1 7.4 ns
CL = 5 pF, 10 pF, 15 pF and 30 pF

CPD power dissipation
capacitance
fi = 1 MHz; VI =GND to VCC [3][4]
VCC = 0.8 V - 2.7 - - - - pF
VCC = 1.1 V to 1.3 V - 2.8 - - - - pF
VCC = 1.4 V to 1.6 V - 3.0 - - - - pF
VCC = 1.65 V to 1.95 V - 3.2 - - - - pF
VCC = 2.3 V to 2.7 V - 3.8 - - - - pF
VCC = 3.0 V to 3.6 V - 4.4 - - - - pF
Table 9. Dynamic characteristics …continued

Voltages are referenced to GND (ground=0 V); for test circuit see Figure 13.
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate
12. Waveforms

Table 10. Measurement points

0.8 V to 3.6 V 0.5  VCC 0.5  VCC VCC  3.0 ns
NXP Semiconductors 74AUP1G58
Low-power configurable multiple function gate

[1] For measuring enable and disable times RL = 5 k, for measuring propagation delays, setup and hold times and pulse width RL = 1 M.
Table 11. Test data

0.8 V to 3.6 V 5 pF, 10 pF, 15 pF and 30 pF 5 k or 1 M open GND 2  VCC
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