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1PS79SB10NXPN/a27000avaiSchottky barrier single diode


1PS79SB10 ,Schottky barrier single diodeLimiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter C ..
1PS79SB17 ,4 V, 30 mA low C_d Schottky barrier diodeapplications:◆ Diode ring mixer◆ RF detector◆ RF voltage doubler1.4 Quick reference dataTable 2: Qu ..
1PS79SB30 ,Schottky barrier single diodeLimiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter C ..
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1PS79SB10
Schottky barrier single diode
1PS79SB10
Schottky barrier single diode14 August 2012 Product data sheet Product profile
1.1 General description

Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small Surface-Mounted Device (SMD) plasticpackage.
1.2 Features and benefits
Low forward voltage• Guard ring protected• Ultra small plastic SMD package• AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching• Voltage clamping• Protection circuits• Blocking diodes
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
forward current - - 200 mA reverse voltage - - 30 V forward voltage IF = 10 mA; Tamb = 25 °C - - 400 mV Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
K cathode[1] A anode 21
aaa-003679 A
NXP Semiconductors 1PS79SB10
Schottky barrier single diode Ordering information
Table 3. Ordering information
PackageType number
Name Description Version

1PS79SB10 SOD523 plastic surface-mounted package; 2 leads SOD523 Marking
Table 4. Marking codes
Type number Marking code

1PS79SB10 F Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
reverse voltage - 30 V forward current - 200 mA
IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 300 mA
IFSM non-repetitive peak forwardcurrent tp < 10 ms; Tj(init) = 25 °C - 600 mA junction temperature - 125 °C
Tamb ambient temperature -65 125 °C
Tstg storage temperature -65 150 °C Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistancefrom junction to
ambient
in free air [1] - - 450 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standardfootprint.
NXP Semiconductors 1PS79SB10
Schottky barrier single diode Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit

IF = 0.1 mA; Tamb = 25 °C - - 240 mV
IF = 1 mA; Tamb = 25 °C - - 320 mV
IF = 10 mA; Tamb = 25 °C - - 400 mV
IF = 30 mA; Tamb = 25 °C - - 500 mV forward voltage
IF = 100 mA; Tamb = 25 °C - - 800 mV reverse current VR = 25 V; Tamb = 25 °C; pulsed;
tp = 300 µs; δ = 0.02 - 2 µA diode capacitance f = 1 MHz; Tamb = 25 °C; VR = 1 V - - 10 pF3
(mA)(V)
msa892
(3)(2)(1)
(3)(2)(1)
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C 10 20 30VR(V)
10-1(µA)
(1)
(2)
(3)
msa893
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
NXP Semiconductors 1PS79SB10
Schottky barrier single diode
10 20 300(V)(pF)
msa891
f = 1 MHz; Tamb = 25 °C
Fig. 3. Diode capacitance as a function of reverse voltage; typical values Test information
8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications. Package outline
1.651.55 1.251.15
0.650.580.850.75
NXP Semiconductors 1PS79SB10
Schottky barrier single diode
10. Soldering
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523

sod523_froccupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
0.6(2×)0.5(2×)
0.4(2×)0.5(2×)
Fig. 5. Reflow soldering footprint for SOD523 (SOD523)
11. Revision history
Table 8. Revision history
NXP Semiconductors 1PS79SB10
Schottky barrier single diode
12. Legal information
12.1 Data sheet status
Documentstatus [1][2] Productstatus [3] Definition

Objective[short] datasheet
Development This document contains data fromthe objective specification for productdevelopment.
Preliminary[short] datasheet
Qualification This document contains data from thepreliminary specification.
Product[short] datasheet
Production This document contains the productspecification.
[1] Please consult the most recently issued document before initiating orcompleting a design.[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.NXP Semiconductors does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequencesof use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed betweenNXP Semiconductors and its customer, unless NXP Semiconductors andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the NXP Semiconductors productis deemed to offer functions and qualities beyond those described in theProduct data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXPSemiconductors accepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using NXPSemiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercialsale, as published at http:///profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. NXP Semiconductors hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of NXP Semiconductors products by customer.
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