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SSM3K7002BFSTOSHIBAN/a141000avaiSmall-signal MOSFET


SSM3K7002BFS ,Small-signal MOSFETElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ MaxUnitGate l ..
SSM3K7002BFU ,Small-signal MOSFETElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ MaxUnitGate le ..
SSM3K7002BFU ,Small-signal MOSFETAbsolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain-source voltage V 60 V ..
SSM3K7002F ,Small-signal MOSFETElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ MaxUnitGate le ..
SSM3K7002FU ,Small-signal MOSFETElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ MaxUnitGate l ..
SSM4509GM , N- AND P-CHANNEL ENHANCEMENT-MODE POWER MOSFETS
STB4NK60Z ,N-CHANNEL 600Vapplications. Such series comple-ments ST full range of high voltage MOSFETs in-cluding revolutiona ..
STB4NK60ZT4 ,N-CHANNEL 600VABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitSTP4NK60ZSTD4NK60ZSTB4NK60Z STP4NK60ZFPSTD4NK60Z ..
STB50NE08 ,N
STB50NE10L-T4 ,N-CHANNEL 100VABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitV Drain-source Voltage (V = 0)DS GS 100 VV Drain ..
STB55NE06 ,N
STB55NE06 ,N


SSM3K7002BFS
Small-signal MOSFET
SSM3K7002BFS
TOSHIBA Field-Effect Transistor Silicon N Channel MOS Type (U-MOSⅣ)
SSM3K7002BFS

High-Speed Switching Applications
Analog Switch Applications
• Small package Low ON-resistance : RDS(ON) = 3.3 Ω (max) (@VGS = 4.5 V) : RDS(ON) = 2.6 Ω (max) (@VGS = 5 V)
: RDS(ON) = 2.1 Ω (max) (@VGS = 10 V)
Absolute Maximum Ratings (Ta = 25°C)

Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6mm, Cu Pad: 0.36 mm2 × 3)
Marking Equivalent Circuit (top view)

Unit: mm
Weight: 2.4 mg (typ.)
1 2 2
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