PSMN8R0-40PS ,N-channel 40 V 7.6 m鈩?standard level MOSFETApplications DC-to-DC convertors Motor control Load switching Server power supplies1.4 Quick re ..
PSMN8R5-100ES ,N-channel 100 V 8.5 m惟 standard level MOSFET in I2PAKApplications• AC-to-DC power supply equipmentMotor control•• Server power suppliesSynchronous recti ..
PSMN8R5-60YS ,N-channel LFPAK 60 V, 8 m惟 standard level MOSFETApplications DC-to-DC converters Motor control Lithium-ion battery protection Server power supp ..
PSMN8R7-80BS ,N-channel 80 V 8.7 m鈩?standard level MOSFET in D2PAKApplications DC-to-DC converters Motor control Load switching Server power supplies1.4 Quick re ..
PSMN8R7-80PS ,N-channel 80 V 8.7 m鈩?standard level MOSFET in TO-220Applications DC-to-DC converters Motor control Load switching Server power supplies1.4 Quick re ..
PSMN9R5-100BS ,N-channel 100 V 9.6 m鈩?standard level MOSFET in D2PAKApplications DC-to-DC converters Motor control Load switching Server power supplies1.4 Quick re ..
QL63D5SA , InGaAlP Laser Diode
QLX4600SIQT7 , Quad Lane Extender
QM15TG-9B , MEDIUM POWER SWITCHING USE INSULATED TYPE
QM15TG-9B , MEDIUM POWER SWITCHING USE INSULATED TYPE
QM20TG-9B , MEDIUM POWER SWITCHING USE INSULATED TYPE
QM20TG-9B , MEDIUM POWER SWITCHING USE INSULATED TYPE
PSMN8R0-40PS
N-channel 40 V 7.6 m鈩?standard level MOSFET
PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET
Rev. 02 — 25 June 2009 Product data sheet Product profile
1.1 General descriptionStandard level N-channel MOSFET in TO220 package qualified to 175 °C. This product is
designed and qualified for use in a wide range of industrial, communications and domestic
equipment.
1.2 Features and benefits High efficiency due to low switching
and conduction losses Suitable for standard level gate drive
sources
1.3 Applications DC-to-DC convertors Load switching Motor control Server power supplies
1.4 Quick reference data[1] Measured 3 mm from package.
Table 1. Quick referenceVDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - - 40 V drain current Tmb =25°C; VGS =10V;
see Figure 1
--77 A
Ptot total power
dissipation
Tmb=25 °C; see Figure 2 --86 W
Dynamic characteristicsQGD gate-drain charge VGS =10V; ID =25A;
VDS=20 V; see Figure 14;
see Figure 15
-3.8 -nC
Static characteristicsRDSon drain-source
on-state resistance
VGS =10V; ID =25A; =25 °C; see Figure 13
[1] -6.2 7.6 mΩ
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET Pinning information Ordering information
Table 2. Pinning information gate
SOT78
(TO-220AB) drain source D mounting base; connected to
drain
Table 3. Ordering informationPSMN8R0-40PS TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead
TO-220AB
SOT78
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET Limiting values
Table 4. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 40 V
VDGR drain-gate voltage Tj≥25 °C; Tj≤ 175 °C; RGS =20kΩ -40 V
VGS gate-source voltage -20 20 V drain current VGS =10V; Tmb= 100 °C; see Figure 1 -55 A
VGS =10V; Tmb =25°C; see Figure 1 -77 A
IDM peak drain current tp≤10 µs; pulsed; Tmb =25°C; see Figure 3 -309 A
Ptot total power dissipation Tmb =25°C; see Figure 2 -86 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
Source-drain diode source current Tmb =25°C - 77 A
ISM peak source current tp≤10 µs; pulsed; Tmb =25°C - 309 A
Avalanche ruggednessEDS(AL)S non-repetitive
drain-source avalanche
energy
VGS =10V; Tj(init) =25°C; ID =77A; Vsup≤40V;
unclamped; RGS =50Ω
-43 mJ
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET Thermal characteristics
Table 5. Thermal characteristicsRth(j-mb) thermal resistance from junction to
mounting base
see Figure 4 - 1.2 1.74 K/W
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET CharacteristicsTable 6. Characteristics
Static characteristicsV(BR)DSS drain-source
breakdown voltage =250 µA; VGS =0V; Tj =-55°C 36 - - V =250 µA; VGS =0V; Tj =25°C 40 - - V
VGS(th) gate-source threshold
voltage =1mA; VDS = VGS; Tj =-55 °C;
see Figure 11; see Figure 12
--4.6 V =1mA; VDS = VGS; Tj= 175 °C;
see Figure 11; see Figure 12 - V =1mA; VDS = VGS; Tj =25°C;
see Figure 11; see Figure 12
234 V
IDSS drain leakage current VDS =40V; VGS =0V; Tj=25°C --1.5 µA
VDS =40V; VGS =0V; Tj= 125°C --30 µA
IGSS gate leakage current VGS =20V; VDS =0V; Tj=25°C - - 100 nA
VGS =-20 V; VDS =0V; Tj=25°C - - 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =25A; Tj= 100 °C;
see Figure 13
--11 mΩ
VGS =10V; ID =25A; Tj =25°C;
see Figure 13
[2] -6.2 7.6 mΩ internal gate resistance
(AC)
f=1MHz - 1.1 - Ω
Dynamic characteristicsQG(tot) total gate charge ID =0A; VDS =0V; VGS =10V - 17 - nC =25A; VDS =20V; VGS =10V;
see Figure 14; see Figure 15
-21 - nC
QGS gate-source charge ID =25A; VDS =20V; VGS =10V;
see Figure 14; see Figure 15
-7.2 - nC
QGS(th) pre-threshold
gate-source charge =25A; VDS =20V; VGS =10V;
see Figure 14
-3.6 - nC
QGS(th-pl) post-threshold
gate-source charge
-3.6 - nC
QGD gate-drain charge ID =25A; VDS =20V; VGS =10V;
see Figure 14; see Figure 15
-3.8 - nC
VGS(pl) gate-source plateau
voltage =25A; VDS =20V; see Figure 14 -4.8 - V
Ciss input capacitance VDS =12V; VGS=0 V; f=1 MHz; =25°C; see Figure 16 1262 - pF
Coss output capacitance - 327 - pF
Crss reverse transfer
capacitance 160 - pF
td(on) turn-on delay time VDS =12V; RL =0.5 Ω; VGS =10V;
RG(ext) =4.7Ω
-12 - ns rise time - 4.7 - ns
td(off) turn-off delay time - 21 - ns fall time - 4.7 - ns
NXP Semiconductors PSMN8R0-40PS
N-channel 40 V 7.6 mΩ standard level MOSFET[1] Tested to JEDEC standards where applicable.
[2] Measured 3 mm from package.
Source-drain diodeVSD source-drain voltage IS =25A; VGS =0V; Tj =25°C;
see Figure 17 0.85 1.2 V
trr reverse recovery time IS =50A; dIS/dt= -100 A/µs; VGS =0V;
VDS =20V
-30 - ns recovered charge IS =50A; dIS/dt= -100 A/µs; VGS =0V;
VDS =20V; Tj =25°C
-18 - nC
Table 6. Characteristics …continued
