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PSMN5R0-100PS |PSMN5R0100PSNXP/PHN/a10000avaiN-channel 100 V 5 m惟 standard level MOSFET in TO-220
PSMN5R0-100PS |PSMN5R0100PSNXPN/a10avaiN-channel 100 V 5 m惟 standard level MOSFET in TO-220


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PSMN5R0-100PS
N-channel 100 V 5 m惟 standard level MOSFET in TO-220
Product profile1.1 General description
Standard level N-channel MOSFET in a TO-220 package qualified to 175 °C. This product
is designed and qualified for use in a wide range of industrial, communications and
domestic equipment.
1.2 Features and benefits
High efficiency due to low switching
and conduction losses Suitable for standard level gate drive
sources
1.3 Applications
DC-to-DC converters Load switching Motor control Server power supplies
1.4 Quick reference data

PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220
Rev. 3 — 26 September 2011 Product data sheet
Table 1. Quick reference data

VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - - 100 V drain current Tmb =25°C; VGS =10V; see Figure 1
[1] --120 A
Ptot total power dissipation Tmb =25°C; see Figure 2 --338 W junction temperature -55 - 175 °C
Static characteristics

RDSon drain-source on-state
resistance
VGS =10V; ID =25A; = 100 °C; see Figure 12;
see Figure 13
-7.7 9 mΩ
VGS =10V; ID =25A; Tj =25 °C; see Figure 13
[2] -4.3 5 mΩ
Dynamic characteristics

QGD gate-drain charge VGS =10V; ID =75A;
VDS=50 V; see Figure 14;
see Figure 15
-49 -nC
QG(tot) total gate charge - 170- nC
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source avalanche
energy
VGS =10V; Tj(init) =25°C; ID= 120 A; Vsup≤ 100V;
RGS =50 Ω; Unclamped
--537 mJ
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220

[1] Continuous current limited by package
[2] Measured 3 mm from package. Pinning information Ordering information
Table 2. Pinning information
Table 3. Ordering information

PSMN5R0-100PS TO-220AB plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220 Limiting values

[1] Continuous current limited by package
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 100 V
VDGR drain-gate voltage Tj≥25 °C; Tj≤ 175 °C; RGS =20kΩ - 100 V
VGS gate-source voltage -20 20 V drain current VGS =10V; Tj= 100 °C; see Figure 1 -110 A
VGS =10V; Tmb =25°C; see Figure 1 [1]- 120 A
IDM peak drain current pulsed; tp≤10 µs; Tmb =25°C;
see Figure 3 622 A
Ptot total power dissipation Tmb =25°C; see Figure 2 - 338 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
Tsld(M) peak soldering temperature - 260 °C
Source-drain diode
source current Tmb =25°C [1]- 120 A
ISM peak source current pulsed; tp≤10 µs; Tmb=25°C - 622 A
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source
avalanche energy
VGS =10V; Tj(init) =25°C; ID= 120A;
Vsup≤ 100 V; RGS =50 Ω; Unclamped 537 mJ
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220 Thermal characteristics

Table 5. Thermal characteristics

Rth(j-mb) thermal resistance from junction to mounting
base
see Figure 4 - 0.22 0.44 K/W
Rth(j-a) thermal resistance from junction to ambient vertical in free air - 60 - K/W
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220 Characteristics
Table 6. Characteristics
Static characteristics

V(BR)DSS drain-source breakdown
voltage= 250 µA; VGS =0V; Tj=25°C 100 - - V= 250 µA; VGS =0V; Tj= -55°C 90 - - V
VGS(th) gate-source threshold voltageID =1mA; VDS =VGS; Tj =-55 °C;
see Figure 10
--4.6 V =1mA; VDS =VGS; Tj =175 °C;
see Figure 10 --V =1mA; VDS =VGS; Tj =25°C;
see Figure 11; see Figure 10
234V
IDSS drain leakage current VDS =100 V; VGS =0V; Tj=25°C - 0.08 10 µA
VDS =100 V; VGS =0V; Tj= 175°C - - 500 µA
IGSS gate leakage current VGS =-20 V; VDS =0V; Tj=25°C - 10 100 nA
VGS =20V; VDS =0V; Tj=25°C - 10 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =25A; Tj =175 °C;
see Figure 12; see Figure 13 1214mΩ
VGS =10V; ID =25A; Tj =100 °C;
see Figure 12; see Figure 13
-7.7 9 mΩ
VGS =10V; ID =25A; Tj =25°C;
see Figure 13
[1] -4.3 5 mΩ gate resistance f=1 MHz - 0.9 - Ω
Dynamic characteristics

QG(tot) total gate charge ID =75A; VDS =50V; VGS =10V;
see Figure 14; see Figure 15 170 - nC =0A; VDS =0V; VGS=10V - 140 - nC
QGS gate-source charge ID =75A; VDS =50V; VGS =10V;
see Figure 14; see Figure 15
-48 -nC
QGS(th) pre-threshold gate-source
charge
-31 -nC
QGS(th-pl) post-threshold gate-source
charge 17.3 - nC
QGD gate-drain charge - 49 - nC
VGS(pl) gate-source plateau voltage VDS=50 V; see Figure 14;
see Figure 15
-5.1 -V
Ciss input capacitance VDS =50V; VGS =0V; f=1MHz; =25°C; see Figure 16 9900 - pF
Coss output capacitance - 660 - pF
Crss reverse transfer capacitance - 381 - pF
td(on) turn-on delay time VDS =50V; RL =0.67 Ω; VGS =10V;
RG(ext) =4.7 Ω; ID =75 A; Tj =25°C
-45 -ns rise time - 91 - ns
td(off) turn-off delay time - 122 - ns fall time - 63 - ns
NXP Semiconductors PSMN5R0-100PS
N-channel 100 V 5 mΩ standard level MOSFET in TO-220

[1] Measured 3 mm from package.
Source-drain diode

VSD source-drain voltage IS =25A; VGS =0V; Tj =25°C;
see Figure 17
-0.8 1.2 V
trr reverse recovery time IS =25A; dIS/dt= -100 A/µs;
VGS =0V; VDS =50V
-75 -ns recovered charge - 235 - nC
Table 6. Characteristics …continued
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