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PSMN1R1-40BS |PSMN1R140BSNXP/PHN/a10000avaiN-channel 40 V 1.3 m鈩?standard level MOSFET in D2PAK


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PSMN1R1-40BS
N-channel 40 V 1.3 m鈩?standard level MOSFET in D2PAK
Product profile1.1 General description
Standard level N-channel MOSFET in D2PAK (SOT404) package qualified to 175 °C. This
product is designed and qualified for use in a wide range of industrial, communications
and domestic equipment.
1.2 Features and benefits
High efficiency due to low switching
and conduction losses Suitable for standard level gate drive
sources
1.3 Applications
DC-to-DC convertors Load switching Motor control Server power supplies
1.4 Quick reference data

[1] Continuous current is limited by package
PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK
Rev. 2 — 29 February 2012 Product data sheet
Table 1. Quick reference data

VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C --40 V drain current Tmb =25°C; VGS =10V; see Figure 1 [1]- - 120 A
Ptot total power dissipation Tmb =25°C; see Figure 2 - - 306 W junction temperature -55 - 175 °C
Static characteristics

RDSon drain-source on-state resistance VGS =10V; ID =25A; Tj= 100 °C;see Figure 12;see Figure 13 -1.68 2 mΩ
VGS =10V; ID =25A; Tj =25°C;
see Figure 13 1.16 1.3 mΩ
Dynamic characteristics

QGD gate-drain charge VGS =10V; ID =75A; VDS =20V;
see Figure 14;see Figure 15
-32 -nC
QG(tot) total gate charge - 136 - nC
Avalanche ruggedness

EDS(AL)S non-repetitive
drain-source
avalanche energy
VGS =10V; Tj(init) =25°C; ID =120A;
Vsup≤40 V; unclamped; RGS =50Ω; tp =0.1ms
--1.4 J
NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK Pinning information

[1] It is not possible to make connection to pin 2. Ordering information Limiting values
[1] Continuous current is limited by package.
Table 2. Pinning information
Table 3. Ordering information

PSMN1R1-40BS D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads
(one lead cropped)
SOT404
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 40 V
VDGR drain-gate voltage Tj≥25 °C; Tj≤ 175 °C; RGS =20kΩ -40 V
VGS gate-source voltage -20 20 V drain current VGS =10V; Tmb =100°C [1]- 120 A
VGS =10V; Tmb =25°C; see Figure 1 [1]- 120 A
IDM peak drain current pulsed; tp≤10 µs; Tmb =25°C; see Figure 3 - 1320A
Ptot total power dissipation Tmb =25°C; see Figure 2 - 306 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
Tsld(M) peak soldering temperature - 260 °C
Source-drain diode
source current Tmb =25°C [1]- 120 A
ISM peak source current pulsed; tp≤10 µs; Tmb=25°C - 1320A
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source
avalanche energy
VGS =10V; Tj(init) =25°C; ID =120 A; Vsup≤40V;
unclamped; RGS =50 Ω; tp =0.1ms
-1.4 J
NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK

NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK Thermal characteristics

Table 5. Thermal characteristics

Rth(j-mb) thermal resistance from
junction to mounting base
see Figure 4 - 0.22 0.49 K/W
Rth(j-a) thermal resistance from
junction to ambient
minimum footprint; mounted on
a printed-circuit board
-50 -K/W
NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK Characteristics
Table 6. Characteristics
Static characteristics

V(BR)DSS drain-source
breakdown voltage =250 µA; VGS =0V; Tj= -55°C 36 - - V =250 µA; VGS =0V; Tj=25°C 40 --V
VGS(th) gate-source threshold
voltage =1mA; VDS =VGS; Tj =-55 °C;
see Figure 10
--4.6 V =1mA; VDS =VGS; Tj= 175 °C;
see Figure 10 --V =1mA; VDS =VGS; Tj =25°C;
see Figure 11;see Figure 10
234V
IDSS drain leakage current VDS =40V; VGS =0V; Tj=25°C - 0.02 10 µA
VDS =40V; VGS =0V; Tj= 175°C - - 500 µA
IGSS gate leakage current VGS =20V; VDS =0V; Tj=25°C - 10 100 nA
VGS =-20 V; VDS =0V; Tj=25°C - 10 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =25A; Tj= 100 °C;
see Figure 12;see Figure 13
-1.68 2 mΩ
VGS =10V; ID =25A; Tj= 175 °C;
see Figure 12;see Figure 13
-2.3 2.8 mΩ
VGS =10V; ID =25A; Tj =25°C;
see Figure 13 1.16 1.3 mΩ internal gate resistance
(AC)
f=1MHz - 1.1 - Ω
Dynamic characteristics

QG(tot) total gate charge ID =0A; VDS =0V; VGS=10V - 133 - nC =75A; VDS =20V; VGS =10V;
see Figure 14;see Figure 15 136 - nC
QGS gate-source charge - 52 - nC
QGS(th) pre-threshold
gate-source charge
-30 -nC
QGS(th-pl) post-threshold
gate-source charge
-22 -nC
QGD gate-drain charge - 32 - nC
VGS(pl) gate-source plateau
voltage =75A; VDS=20 V;see Figure 14;
see Figure 15
-6.1 -V
Ciss input capacitance VDS =20V; VGS=0 V; f=1 MHz; =25 °C;see Figure 16 9710 - pF
Coss output capacitance - 2042 - pF
Crss reverse transfer
capacitance 994 - pF
td(on) turn-on delay time VDS =20V; RL =0.8 Ω; VGS =5V;
RG(ext) =4.7Ω
-45 -ns rise time - 66 - ns
td(off) turn-off delay time - 111 - ns fall time - 53 - ns
NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK

Source-drain diode

VSD source-drain voltage IS =25A; VGS =0V; Tj =25°C;
see Figure 17
-0.8 1.2 V
trr reverse recovery time IS =25A; dIS/dt= -100 A/µs; VGS =0V;
VDS =20V
-64 -ns recovered charge - 117 - nC
Table 6. Characteristics …continued
NXP Semiconductors PSMN1R1-40BS
N-channel 40 V 1.3 mΩ standard level MOSFET in D2PAK
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