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FDD8586FAIRCHILN/a25200avaiN-Channel PowerTrench® MOSFET 20V, 35A, 5.5mOhms


FDD8586 ,N-Channel PowerTrench® MOSFET 20V, 35A, 5.5mOhmsGeneral Description„ Max r = 5.5mΩ at V = 10V, I = 35AThis N-Channel MOSFET has been designed speci ..
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FDD8586
N-Channel PowerTrench® MOSFET 20V, 35A, 5.5mOhms
® FDD8586/FDU8586 N-Channel PowerTrench MOSFET January 2007 FDD8586/FDU8586 tm ® N-Channel PowerTrench MOSFET 20V, 35A, 5.5mΩ Features General Description „ Max r = 5.5mΩ at V = 10V, I = 35A This N-Channel MOSFET has been designed specifically DS(on) GS D to improve the overall efficiency of DC/DC converters using „ Max r = 8.5mΩ at V = 4.5V, I = 33A DS(on) GS D either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low „ Low gate charge: Q = 34nC(Typ), V = 10V g(TOT) GS r and fast switching speed. DS(on) „ Low gate resistance Application „ 100% Avalanche tested „ Vcore DC-DC for Desktop Computers and Servers „ RoHS compliant „ VRM for Intermediate Bus Architecture D G I-PAK G DS (TO-251AA) S MOSFET Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 20 V DS V Gate to Source Voltage ±20 V GS Drain Current -Continuous (Package Limited) 35 I -Continuous (Die Limited) 93 A D -Pulsed (Note 1) 354 E Single Pulse Avalanche Energy (Note 2) 144 mJ AS P Power Dissipation 77 W D T , T Operating and Storage Temperature -55 to 175 °C J STG Thermal Characteristics R Thermal Resistance, Junction to Case TO-252,TO-251 1.94 °C/W θJC R Thermal Resistance, Junction to Ambient TO-252,TO-251 100 °C/W θJA 2 R Thermal Resistance, Junction to Ambient TO-252,1in copper pad area 52 °C/W θJA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDD8586 FDD8586 TO-252AA 13’’ 12mm 2500 units FDU8586 FDU8586 TO-251AA N/A(Tube) N/A 75 units ©2007 1 FDD8586/FDU8586 Rev. B
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